Sensor package and method for producing a sensor package

ABSTRACT

A sensor package including a metal carrier and a sensor chip arranged on the metal carrier and having a first sensor element. In an orthogonal projection of the sensor chip onto a surface of the metal carrier, at least two edge sections of the sensor chip are free of overlap with the surface of the metal carrier. The sensor chip is designed to detect a magnetic field induced by an electric current flowing through a current conductor.

TECHNICAL FIELD

The present disclosure relates to sensor packages and methods forproducing sensor packages.

BACKGROUND

In sensor packages, sensor chips can be mounted on metal carriers. Thesensor chips can be designed to measure magnetic fields induced by anelectric current flowing through a current conductor. Particularly atrelatively high frequencies of AC electric currents, eddy currents canbe generated in the metal carriers. The eddy currents generated cancause errors in the magnetic field strengths measured by the sensorchips. Manufacturers of sensor packages endeavor to provide improvedsensor packages and methods for producing improved sensor packages. Inparticular, it may be desirable to provide sensor packages that provideaccurate measurement results despite eddy currents being present.Furthermore, it may be desirable to specify methods for producing suchsensor packages.

BRIEF SUMMARY

One aspect of the disclosure relates to a sensor package comprising ametal carrier, and a sensor chip arranged on the metal carrier andhaving a first sensor element, wherein in an orthogonal projection ofthe sensor chip onto a surface of the metal carrier, at least two edgesections of the sensor chip are free of overlap with the surface of themetal carrier, wherein the sensor chip is designed to detect a magneticfield induced by an electric current flowing through a currentconductor.

A further aspect of the disclosure relates to a method for producing asensor package, the method comprising providing a metal carrier, andarranging a sensor chip having a sensor element on the metal carrier,wherein in an orthogonal projection of the sensor chip onto a surface ofthe metal carrier, at least two edge sections of the sensor chip arefree of overlap with the surface of the metal carrier.

BRIEF DESCRIPTION OF THE DRAWINGS

Sensor packages and methods for producing sensor packages in accordancewith the disclosure are explained in greater detail below with referenceto drawings. The elements shown in the drawings are not necessarilyrendered in a manner true to scale relative to one another. Identicalreference signs may designate identical components.

FIG. 1 contains FIGS. 1A and 1B, which schematically show across-sectional side view and a plan view of a sensor package 100 inaccordance with the disclosure.

FIG. 2 contains FIGS. 2A and 2B, which schematically show across-sectional side view and a plan view of a sensor package 200 inaccordance with the disclosure.

FIG. 3 contains FIGS. 3A and 3B, which schematically show across-sectional side view and a plan view of a sensor package 300 inaccordance with the disclosure.

FIG. 4 contains FIGS. 4A and 4B, which schematically show across-sectional side view and a plan view of a sensor package 400 inaccordance with the disclosure.

FIG. 5 shows a plan view of a sensor package 500 in accordance with thedisclosure. Positions at which a sensor element can be arranged areillustrated in FIG. 5. Furthermore, positions at which a sensor elementshould not be arranged are illustrated.

FIG. 6 shows a plan view of a sensor package 600 in accordance with thedisclosure. Regions at which a sensor element can be arranged areillustrated in FIG. 6.

Furthermore, regions at which a sensor element should not be arrangedare illustrated.

FIG. 7 contains FIGS. 7A to 7F, which schematically show plan views ofsensor packages 700A to 700F in accordance with the disclosure.

FIG. 8 shows a perspective view of a sensor package 800 in accordancewith the disclosure, which sensor package is arranged in a currentconductor.

FIG. 9 schematically shows a cross-sectional side view of a sensorpackage 900 in accordance with the disclosure.

FIG. 10 shows a flow diagram of a method for producing a sensor packagein accordance with the disclosure.

DETAILED DESCRIPTION

FIG. 1 contains FIGS. 1A and 1B and shows one example of a sensorpackage 100 in accordance with the disclosure. FIG. 1A shows across-sectional side view of the sensor package 100. FIG. 1B shows aplan view of the sensor package 100. The following observationsregarding the sensor package 100 may also be applied to other sensorpackages in accordance with the disclosure.

The sensor package 100 contains a metal carrier 2 and a sensor chip 6arranged on a surface 4 of the metal carrier 2. The sensor chip 6 can besecured on the metal carrier 2 by way of a layer 8. The sensor chip 6comprises sensor elements 10, which can be arranged on a side of thesensor chip 6 facing away from the metal carrier 2. The sensor chip 6can comprise electrical connections 12 on its top side, which electricalconnections can be electrically connected to connection conductors 16 ofthe metal carrier 2 via bond wires 14. The sensor package 100 cancomprise an encapsulation material 18, which can at least partlyencapsulate the components of the sensor package 100.

In the example in FIG. 1, the sensor package 100 can be a “leadless”package. In further examples, sensor packages in accordance with thedisclosure can also be “flat lead” packages or “gullwing” packages, forexample. The metal carrier 2 can be produced from copper, nickel,aluminum or high-grade steel, for example. In the example in FIG. 1, themetal carrier 2 can comprise a die pad 20 and a plurality of connectionconductors 16. The sensor chip 6 can be secured on the die pad 20 bymeans of the layer 8. The layer 8 can be a solder layer or an adhesivelayer, for example. The electrical connections 12 of the sensor chip 6can be electrically connected to the connection conductors 16 via thebond wires 14. The sensor chip 6 can thus be electrically contacted fromoutside the encapsulation material 18 via the connection conductors 16.The encapsulation material 18 can be fabricated for example from alaminate, an epoxy resin, a thermoplastic or a thermosetting polymer.

The sensor chip 6 or the sensor element 10 can be designed to detect amagnetic field induced by an electric current flowing through a currentconductor (not illustrated). In this case, the sensor element 10 can inparticular face the current conductor. The current conductor can bearranged in particular outside the sensor package 100. The electriccurrent flowing through the current conductor does not flow through themetal carrier 2. The sensor package 100 can be in particular a corelesssensor package, that is to say that the sensor package 100 does not useor contain a flux concentrator to concentrate the magnetic fieldgenerated by the electric current. In one example, a magnetic core canbe used as a concentrator of the magnetic flux. In a further example, asoft-magnetic metal sheet can be used as a concentrator of the magneticflux.

The sensor chip 6 can comprise one or more sensor elements 10, whereineach of the sensor elements 10 can be designed to detect the value of amagnetic field. In the example in FIG. 1, the sensor chip 6 comprisestwo sensor elements 10 and can be a differential sensor chip 6. Infurther examples, the number of sensor elements 10 can deviate from theexample in FIG. 1. For example, a sensor chip can also comprise a singlesensor element or three sensor elements.

The sensor chip 6 can be, in particular, an integrated circuit, suchthat reference can also be made to a sensor IC. In one example, thesensor chip 6 can be a Hall sensor or a Hall IC. In further examples,the sensor chip 6 can be an xMR sensor, in particular an AMR sensor, aGMR sensor or a TMR sensor. In the case of a Hall sensor, the sensorelements 10 can be Hall elements or Hall sensor elements, which can beintegrated into the circuit. Signal amplification, analog-to-digitalconversion, digital signal processing and offset and temperaturecompensation can furthermore be carried out in the Hall IC. Besides theHall plates, the components for signal amplification and/oranalog-to-digital conversion may or may not be regarded as part of thesensor element 10. In one example, the Hall sensor can be a lateral Hallsensor, which detects magnetic fields perpendicular to the chip surface.In a further example, the Hall sensor can be a vertical Hall sensor,which detects magnetic fields parallel to the chip surface.

In the example in FIG. 1, the sensor chip 6 has a rectangular shape inplan view and has four edges 22A, 22B, 22C, 22D. It is evident from FIG.1B that in an orthogonal projection of the sensor chip 6 onto thesurface 4 of the metal carrier 2, exactly three edges 22A, 22C and 22Dof the sensor chip 6 are free of overlap with the surface 4 of the metalcarrier 2. More precisely, in the orthogonal projection, four edgesections of the sensor chip 6 are free of overlap with the surface 4 ofthe metal carrier 2, namely one edge section of the edge 22A, one edgesection of the edge 22C and two edge sections of the edge 22D. Theorthogonal projection is effected in FIG. 1 along a z-axis shown in FIG.1A, which z-axis can extend in particular perpendicular to the surfaceof the sensor chip 6 and respectively to the surface 4 of the metalcarrier 2. In the orthogonal projection of the sensor chip 6 onto thesurface 4 of the metal carrier 2, two corners of the sensor chip 6 arefree of overlap with the surface 4 of the metal carrier 2. In theexample in FIG. 1, the sensor elements 10 are arranged in the twooverlap-free corners. It is evident from FIG. 1A that the sensor chip 6hangs over the edge of the metal carrier 2 at the overlap-free corners.

As already mentioned, sensor chips can be designed to measure magneticfields induced by an electric current flowing through a currentconductor. Particularly in the case of AC currents having relativelyhigh frequencies, eddy currents can be generated in metal carriers ofthe sensor devices. Such eddy currents are often also referred to inGerman as Eddy-Currents. The intensity of the magnetic field strengthsdetected by the sensor elements of the sensor chip can be altered, inparticular reduced, by the eddy currents generated. In other words, thesensor elements cannot accurately detect the strength of the magneticfield on account of the eddy currents generated. In the plan view inFIG. 1B, the sensor elements 10 and the metal carrier 2 are arranged ina manner free of overlap. The influence of the eddy currents on themeasurement results can be reduced as a result of this arrangement ofthe sensor elements 10 relative to the metal carrier 2.

FIG. 2 contains FIGS. 2A and 2B and shows one example of a sensorpackage 200 in accordance with the disclosure. FIG. 2A shows across-sectional side view of the sensor package 200. FIG. 2B shows aplan view of the sensor package 200. The sensor package 200 can besimilar to the sensor package 100 from FIG. 1 and comprise identicalcomponents.

The metal carriers 2 of the sensor packages 100 and 200 have differentshapes. It is evident from FIG. 2B that in an orthogonal projection ofthe sensor chip 6 onto the surface 4 of the metal carrier 2, exactlythree edges 22A, 22C and 22D of the sensor chip 6 are free of overlapwith the surface 4 of the metal carrier 2. In the orthogonal projectionof the sensor chip 6 onto the surface 4 of the metal carrier 2, astrip-shaped partial surface of the sensor chip 6 is free of overlapwith the surface 4 of the metal carrier 2. In the example in FIG. 2, thesensor elements 10 are arranged within the overlap-free strip and in thetwo overlap-free corners of the sensor chip 6.

FIG. 3 contains FIGS. 3A and 3B and shows one example of a sensorpackage 300 in accordance with the disclosure. FIG. 3A shows across-sectional side view of the sensor package 300. FIG. 3B shows aplan view of the sensor package 300. The sensor package 300 can besimilar to the sensor package 100 from FIG. 1 and comprise identicalcomponents.

The metal carriers 2 of the sensor packages 100 and 300 have differentshapes. In the example in FIG. 3, the metal carrier comprises a die pad20 and connection conductors 16 arranged around the die pad 20. It isevident from FIG. 3A that the connection conductors 16 projecting fromthe encapsulation material 18 are bent in a wing-shaped fashion. Thesensor package 300 in FIG. 3 can be, in particular, a “gullwing”package. It is evident from FIG. 3B that in an orthogonal projection ofthe sensor chip 6 onto the surface 4 of the metal carrier 2, exactlythree edges 22A, 22C and 22D of the sensor chip 6 are free of overlapwith the surface 4 of the metal carrier 2. In the example in FIG. 3B,this can be achieved, inter alia, by means of a curved shape of the diepad 20. In the orthogonal projection of the sensor chip 6 onto thesurface 4 of the metal carrier 2, a strip-shaped partial surface of thesensor chip 6 is free of overlap with the surface of the metal carrier2. In the example in FIG. 3, the sensor elements 10 are arranged withinthe overlap-free strip and in the two overlap-free corners of the sensorchip 6.

FIG. 4 contains FIGS. 4A and 4B and shows one example of a sensorpackage 400 in accordance with the disclosure. FIG. 4A shows across-sectional side view of the sensor package 400. FIG. 4B shows aplan view of the sensor package 400.

The sensor package 400 contains a metal carrier 2 comprising a die pad20 and connection conductors 16. A sensor chip 6 having a sensor element10 is arranged above a surface 4 of the metal carrier 2. In the examplein FIG. 4, the sensor chip 6 comprises a single sensor element 10, whichcan face the metal carrier 2. In further examples, the sensor chip 6 canalso comprise any other number of sensor elements 10, in particular twoor three sensor elements. The sensor chip 6 can be secured on the metalcarrier for example by way of a layer (not illustrated). The sensorpackage 400 can furthermore comprise an encapsulation material 18, whichat least partly encapsulates the components of the sensor package 400.

The sensor package 400 can be arranged above a current conductor 24. Inthis case, the sensor element 10 can face the current conductor 24. Thecurrent conductor 24 can be for example a busbar or a current conductor(e.g. a copper layer) of a printed circuit board. The current conductor24 is arranged outside the sensor package 400 and should therefore notbe regarded as part of the sensor package 400. However, the sensorpackage 400 and the current conductor 24 can form a common device. Inthe example in FIG. 4, the metal carrier 2 is arranged between thecurrent conductor 24 and the sensor chip 6. In this case, the surface 4of the metal carrier 2 can be arranged substantially parallel to thecurrent conductor 24. The sensor chip 6 is designed to detect a magneticfield induced by an electric current flowing through the currentconductor 24. The electric current can generate eddy currents in themetal carrier.

It is evident from FIG. 4B that in an orthogonal projection of thesensor chip 6 onto the surface 4 of the metal carrier 2, all four edges22A, 22B, 22C, 22D of the sensor chip 6 are free of overlap with thesurface 4 of the metal carrier 2. In this case, the orthogonalprojection extends along the z-axis shown in FIG. 4A. In the orthogonalprojection of the sensor element 10 onto the surface 4 of the metalcarrier 2, the sensor element 10 is free of overlap with the surface 4of the metal carrier 2. The influence of eddy currents generated in themetal carrier 2 on the measurement results of the sensor chip 6 can bereduced as a result. In the orthogonal projection of the sensor chip 6onto the surface 4 of the metal carrier 2, the sensor chip 6 at leastpartly overlaps the die pad 20 and the connection conductors 16.

FIG. 5 shows a plan view of a sensor package 500 in accordance with thedisclosure. The sensor package 500 can in particular be similar to thesensor package 400 from FIG. 4 and comprise identical components. FIG. 5illustrates positions at which a sensor element of the sensor chip 6 canbe arranged, such that an influence of eddy currents on the measurementresults of the sensor chip 6 can be reduced (cf. sensor elements 10A,10B, 10C, 10D, 10E that are hatched at an angle (45°)). Furthermore,FIG. 5 illustrates positions at which a sensor element of the sensorchip 6 should not be arranged, since eddy currents may otherwise have aninfluence on the measurement results of the sensor chip 6 (cf. sensorelements 10F, 10G that are hatched at an angle (−45°)). The sensorelements or the positions thereof as illustrated in FIG. 5 are notnecessarily actual components of the sensor package 500, but rather areshown merely for illustration purposes in FIG. 5.

The sensor element 10A of the sensor chip 6 can be arranged for examplesuch that in an orthogonal projection of the sensor element 10A onto thesurface 4 of the metal carrier 2, the sensor element 10A and the surfaceof a connection conductor 16 completely overlap. As explained in greaterdetail in association with FIG. 6, in this case the sensor element 10Amust not be too far away from the edge of the connection conductor 16.

The sensor element 10B of the sensor chip 6 can be arranged for examplesuch that in an orthogonal projection of the sensor element 10B onto thesurface 4 of the metal carrier 2, the sensor element 10B and the surfaceof a connection conductor 16 partly overlap.

The sensor element 10C of the sensor chip 6 can be arranged for examplesuch that in an orthogonal projection of the sensor element 10C onto thesurface 4 of the metal carrier 2, the sensor element 10C and the surface4 of the metal carrier 2 do not overlap. Such a sensor element hasalready been discussed in association with FIG. 4.

The sensor element 10D of the sensor chip 6 can be arranged for examplesuch that in an orthogonal projection of the sensor element 10D onto thesurface 4 of the metal carrier 2, the sensor element 10D and the surfaceof the die pad 20 completely overlap. As explained in greater detail inassociation with FIG. 6, in this case the sensor element 10D must not betoo far away from the edge of the die pad 20.

The sensor element 10E of the sensor chip 6 can be arranged for examplesuch that in an orthogonal projection of the sensor element 10E onto thesurface 4 of the metal carrier 2, the sensor element 10E and the surfaceof the die pad 20 partly overlap.

The sensor elements 10F and 10G of the sensor chip 6 can be arranged forexample such that in an orthogonal projection of the respective sensorelement onto the surface 4 of the metal carrier 2, the respective sensorelement and the surface of the die pad 20 completely overlap and thedistance between the sensor element and the edge of the die pad 20 istoo large, as explained in more specific detail in association with FIG.6.

FIG. 6 shows a plan view of a sensor package 600 in accordance with thedisclosure. The sensor package 600 can in particular be similar to thesensor package 400 from FIG. 4 and comprise identical components. FIG. 6illustrates regions at which a sensor element of the sensor chip 6 canbe arranged, such that an influence of eddy currents on the measurementsresults of the sensor chip 6 can be reduced (cf. area hatched at anangle (45°)). Furthermore, FIG. 6 illustrates regions at which a sensorelement of the sensor chip 6 should not be arranged, since eddy currentsmay otherwise have an influence on the measurement results of the sensorchip 6 (cf. area hatched at an angle (−45°)).

The sensor element 10 of the sensor chip 6 can have an extent or width“B”. In FIG. 5, the sensor element 10 is represented by a square havinga side length “B”. In further examples, the shape of the sensor element10 can deviate from the illustration in FIG. 5. In this case, a width ofthe sensor element 10 can correspond to the dimension of the sensorelement 10 in the direction of its maximum extent. The surface of themetal carrier 2 can have a partial surface 26 that is spaced apart fromthe entire edge of the surface of the metal carrier 2 by at least awidth of the sensor element 10. In the example in FIG. 6 such a partialsurface 26 is situated on the die pad 20. In order to reduce aninfluence of eddy currents on the measurement results of the sensor chip6, a sensor element 10 of the sensor chip 6 should be arranged such thatin an orthogonal projection of the sensor element 10 onto the partialsurface 26, the sensor element 10 is free of overlap with the partialsurface 26.

FIG. 7 contains FIGS. 7A to 7F, which schematically show plan views ofsensor packages 700A to 700F in accordance with the disclosure. For thesake of simplicity, only the sensor chip 6 and the metal carrier 2 ofthe respective sensor package are illustrated in FIG. 7. However, thesensor packages in FIG. 7 can be similar to other sensor packages inaccordance with the disclosure as described herein and can accordinglycomprise further components.

FIG. 7A shows a sensor package 700A comprising a metal carrier 2 havingthe shape of a rectangle from which two corners have been removed. Thisresults in a nose structure 28 of the metal carrier 2. In an orthogonalprojection of the sensor chip 6 onto a surface of the metal carrier 2,exactly three edges 22A, 22B and 22D of the sensor chip 6 are free ofoverlap with the surface of the metal carrier 2. Two sensor elements 10of the sensor chip 6 are arranged in the overlap-free corners.

FIG. 7B shows a sensor package 700B comprising a metal carrier 2 havingthe shape of a rectangle from which one corner has been removed. In anorthogonal projection of the sensor chip 6 onto a surface of the metalcarrier 2, exactly two edges 22A and 22B of the sensor chip 6 are freeof overlap with the surface of the metal carrier 2. A sensor element 10of the sensor chip is arranged in the overlap-free corner.

FIG. 7C shows a sensor package 700C comprising a metal carrier 2 havingthe shape of a rectangle. In an orthogonal projection of the sensor chip6 onto a surface of the metal carrier 2, exactly three edges 22A, 22Band 22D of the sensor chip 6 are free of overlap with the surface of themetal carrier 2, such that an overlap-free strip is formed. The twosensor elements 10 of the sensor chip are arranged in the overlap-freecorners of the strip.

FIG. 7D shows a sensor package 700D comprising a metal carrier 2 havingthe shape of a rectangle. In an orthogonal projection of the sensor chip6 onto a surface of the metal carrier 2, exactly four edges 22A, 22B,22C, 22D of the sensor chip 6 are free of overlap with the surface ofthe metal carrier 2. The edge 22C is not completely free of overlap withthe surface of the metal carrier 2. The two sensor elements 10 of thesensor chip 6 are arranged at the sides of the sensor chip 6 in theoverlap-free region.

FIG. 7E shows a sensor package 700E comprising a metal carrier havingfour connection conductors 16. In an orthogonal projection of the sensorchip 6 onto a surface of the metal carrier, exactly four edges 22A, 22B,22C, 22D of the sensor chip 6 are free of overlap with the surface ofthe metal carrier. The edges 22A and 22C are not completely free ofoverlap with the surface of the metal carrier 2. The two sensor elements10 of the sensor chip 6 are arranged at the sides of the sensor chip 6in the overlap-free region.

FIG. 7F shows a sensor package 700F comprising a metal carrier 2 havingthe shape of a rectangle from which four corners have been removed. Inan orthogonal projection of the sensor chip 6 onto a surface of themetal carrier 2, exactly four edges 22A, 22B, 22C, 22D of the sensorchip 6 are free of overlap with the surface of the metal carrier 2. Theedges 22B and 22D are not completely free of overlap with the surface ofthe metal carrier 2. Two sensor elements 10 of the sensor chip arearranged in the upper two overlap-free corners.

FIG. 8 shows a perspective view of an arrangement comprising a sensorpackage 800 and a current conductor 24. The sensor package 800 can besimilar to the sensor package 100 from FIG. 1, for example. The currentconductor 24 can be a busbar having an opening 30. In the example inFIG. 8, the opening 30 can have the shape of a slot. The direction of anelectric current flowing through the busbar 24 is indicated by arrows.The sensor package 800 can be arranged in the slot 30. In this case, thesurface 4 of the metal carrier 2 can extend perpendicular to the busbar24. In FIG. 8, the sensor package 800 is illustrated withoutencapsulation material for the sake of simplicity.

As a result of an arrangement of the sensor package 800 in the opening30 of the busbar 24 and on account of the shape of the busbar 24, it ispossible to generate magnetic fields suitable for a measurement by thesensor package 800. The extent of the slot 30 should be minimized inorder to have only a small influence on the ohmic resistance of thebusbar 24. Accordingly, the extent of the sensor package 800 shouldlikewise be minimized. “Leadless” packages offer a way of satisfyingthis requirement.

FIG. 9 schematically shows a cross-sectional side view of a sensorpackage 900 in accordance with the disclosure. The sensor package 900can be similar to the sensor package 300 from FIG. 3. In contrast toFIG. 3, in FIG. 9, the connection conductors projecting from theencapsulation material 18 are bent in an opposite direction.

FIG. 10 shows a flow diagram of a method for producing a sensor packagein accordance with the disclosure. At 32, a metal carrier is provided.At 34, a sensor chip having a sensor element is arranged on the metalcarrier, wherein in an orthogonal projection of the sensor chip onto asurface of the metal carrier, at least two edges of the sensor chip arefree of overlap with the surface of the metal carrier. The sensor chipis designed to detect a magnetic field induced by an electric currentflowing through a current conductor.

EXAMPLES

Sensor packages and methods for producing sensor packages are explainedin greater detail below on the basis of examples.

Example 1 is a sensor package, comprising: a metal carrier; and a sensorchip arranged on the metal carrier and having a first sensor element,wherein in an orthogonal projection of the sensor chip onto a surface ofthe metal carrier, at least two edge sections of the sensor chip arefree of overlap with the surface of the metal carrier, wherein thesensor chip is designed to detect a magnetic field induced by anelectric current flowing through a current conductor.

Example 2 is a sensor package according to example 1, wherein in anorthogonal projection of the first sensor element onto the surface ofthe metal carrier, the first sensor element is free of overlap with thesurface of the metal carrier.

Example 3 is a sensor package according to example 1 or 2, wherein inthe orthogonal projection of the sensor chip onto the surface of themetal carrier, exactly two edge sections of the sensor chip are free ofoverlap with the surface of the metal carrier, wherein the two edgesections adjoin one another and form an overlap-free corner of thesensor chip.

Example 4 is a sensor package according to example 3, wherein the firstsensor element is arranged in the overlap-free corner of the sensorchip, wherein in an orthogonal projection of the first sensor elementonto the surface of the metal carrier, the first sensor element is freeof overlap with the surface of the metal carrier.

Example 5 is a sensor package according to example 1 or 2, wherein inthe orthogonal projection of the sensor chip onto the surface of themetal carrier, exactly three edge sections of the sensor chip are freeof overlap with the surface of the metal carrier, wherein respectivelytwo of the three edge sections adjoin one another and form a firstoverlap-free corner and a second overlap-free corner of the sensor chip.

Example 6 is a sensor package according to example 5, wherein the sensorchip comprises a second sensor element, wherein the first sensor elementis arranged in the first corner of the sensor chip, wherein in anorthogonal projection of the first sensor element onto the surface ofthe metal carrier, the first sensor element is free of overlap with thesurface of the metal carrier, wherein the second sensor element isarranged in the second corner of the sensor chip, wherein in theorthogonal projection of the second sensor element onto the surface ofthe metal carrier, the second sensor element is free of overlap with thesurface of the metal carrier.

Example 7 is a sensor package according to example 1 or 2, wherein inthe orthogonal projection of the sensor chip onto the surface of themetal carrier, four or more edge sections of the sensor chip are free ofoverlap with the surface of the metal carrier.

Example 8 is a sensor package according to example 1, wherein in anorthogonal projection of the first sensor element onto the surface ofthe metal carrier, the first sensor element and the surface of the metalcarrier at least partly overlap.

Example 9 is a sensor package according to any of the precedingexamples, wherein the surface of the metal carrier comprises a partialsurface that is spaced apart from the entire edge of the surface by atleast a width of the sensor element, wherein in an orthogonal projectionof the first sensor element onto the partial surface, the first sensorelement is free of overlap with the partial surface.

Example 10 is a sensor package according to any of the precedingexamples, wherein the sensor chip is a differential sensor chip.

Example 11 is a sensor package according to any of the precedingexamples, wherein the current conductor is arranged outside the sensorpackage.

Example 12 is a sensor package according to any of the precedingexamples, wherein the current conductor has an opening and the sensorpackage is arranged at least partly in the opening.

Example 13 is a sensor package according to example 12, wherein thesurface of the metal carrier is arranged substantially perpendicular tothe current conductor.

Example 14 is a sensor package according to any of the precedingexamples, wherein the metal carrier is arranged between the currentconductor and the sensor chip.

Example 15 is a sensor package according to any of the precedingexamples, wherein the sensor package is coreless.

Example 16 is a method for producing a sensor package, wherein themethod comprises: providing a metal carrier; and arranging a sensor chiphaving a sensor element on the metal carrier, wherein in an orthogonalprojection of the sensor chip onto a surface of the metal carrier, atleast two edge sections of the sensor chip are free of overlap with thesurface of the metal carrier.

Example 17 is a method according to example 16, wherein arranging thesensor chip is carried out such that in an orthogonal projection of thesensor element onto the surface of the metal carrier, the sensor elementis free of overlap with the surface of the metal carrier.

Although specific embodiments have been illustrated and describedherein, it is obvious to the person of average skill in the art that amultiplicity of alternative and/or equivalent implementations canreplace the specific embodiments shown and described, without departingfrom the scope of the present disclosure. This application is intendedto cover all adaptations or variations of the specific embodimentsdiscussed herein. Therefore, the intention is for this disclosure to berestricted only by the claims and the equivalents thereof.

1. A sensor package, comprising: a metal carrier; and a sensor chiparranged on the metal carrier, having a first sensor element, anddesigned to detect a magnetic field induced by an electric currentflowing through a current conductor, wherein in an orthogonal projectionof the sensor chip onto a surface of the metal carrier, at least twoedge sections of the sensor chip are free of overlap with a surface ofthe metal carrier.
 2. The sensor package as claimed in claim 1, whereinin an orthogonal projection of the first sensor element onto the surfaceof the metal carrier, the first sensor element is free of overlap withthe surface of the metal carrier.
 3. The sensor package as claimed inclaim 1, wherein in the orthogonal projection of the sensor chip ontothe surface of the metal carrier, exactly two edge sections of thesensor chip are free of overlap with the surface of the metal carrier,wherein the two edge sections adjoin one another and form anoverlap-free corner of the sensor chip.
 4. The sensor package as claimedin claim 3, wherein the first sensor element is arranged in theoverlap-free corner of the sensor chip, and in an orthogonal projectionof the first sensor element onto the surface of the metal carrier, thefirst sensor element is free of overlap with the surface of the metalcarrier.
 5. The sensor package as claimed in claim 1, wherein in theorthogonal projection of the sensor chip onto the surface of the metalcarrier, exactly three edge sections of the sensor chip are free ofoverlap with the surface of the metal carrier, and respectively two ofthe three edge sections adjoin one another and form a first overlap-freecorner and a second overlap-free corner of the sensor chip.
 6. Thesensor package as claimed in claim 5, wherein the first sensor elementis arranged in the first corner of the sensor chip, and in an orthogonalprojection of the first sensor element onto the surface of the metalcarrier, the first sensor element is free of overlap with the surface ofthe metal carrier, and wherein the sensor chip comprises a second sensorelement arranged in the second corner of the sensor chip, and in theorthogonal projection of the second sensor element onto the surface ofthe metal carrier, the second sensor element is free of overlap with thesurface of the metal carrier.
 7. The sensor package as claimed in claim1, wherein in the orthogonal projection of the sensor chip onto thesurface of the metal carrier, four or more edge sections of the sensorchip are free of overlap with the surface of the metal carrier.
 8. Thesensor package as claimed in claim 1, wherein in an orthogonalprojection of the first sensor element onto the surface of the metalcarrier, the first sensor element and the surface of the metal carrierat least partly overlap.
 9. The sensor package as claimed in claim 1,wherein the surface of the metal carrier comprises a partial surfacethat is spaced apart from an entire edge of the surface of the metalcarrier by at least a width of the sensor element, and in an orthogonalprojection of the first sensor element onto the partial surface, thefirst sensor element is free of overlap with the partial surface. 10.The sensor package as claimed in claim 1, wherein the sensor chip is adifferential sensor chip.
 11. The sensor package as claimed in claim 1,wherein the current conductor is arranged outside the sensor package.12. The sensor package as claimed in claim 1, wherein the currentconductor has an opening and the sensor package is arranged at leastpartly in the opening.
 13. The sensor package as claimed in claim 12,wherein the surface of the metal carrier is arranged substantiallyperpendicular to the current conductor.
 14. The sensor package asclaimed in claim 1, wherein the metal carrier is arranged between thecurrent conductor and the sensor chip.
 15. The sensor package as claimedin claim 1, wherein the sensor package is coreless.
 16. A method forproducing a sensor package, wherein the method comprises: providing ametal carrier; and arranging a sensor chip having a sensor element onthe metal carrier, wherein in an orthogonal projection of the sensorchip onto a surface of the metal carrier, at least two edge sections ofthe sensor chip are free of overlap with the surface of the metalcarrier.
 17. The method as claimed in claim 16, wherein the arrangingthe sensor chip is carried out such that in an orthogonal projection ofthe sensor element onto the surface of the metal carrier, the sensorelement is free of overlap with the surface of the metal carrier.